- 產(chǎn)品詳情
Rogers MAGTREX 555 高阻抗層壓板是一種先進(jìn)的電路板材料，專為天線設(shè)計和其他高頻應(yīng)用而設(shè)計。這種材料的特點在于其可控的磁導(dǎo)率和介電常數(shù)，使其成為市場上首款商用低損耗層壓板。MAGTREX 555 層壓板的設(shè)計旨在提供設(shè)計靈活性和優(yōu)化，幫助天線設(shè)計人員擴展其設(shè)計的貿(mào)易空間。
| Standard Thicknesses | Standard Panel Size | standard Cladding | |
| 0.040°(1.02mm)+/-0.002” 0.060”(1.52mm)+/-0.003” 0.080”(2.03mm)+/-0.004" 0.100°(2.54mm)+/-0.005” | 0.140°(3.56mm)+/-0.007” 0.200”(5.08mm)+/-0.010" 0.260”(6.60mm)+/-0.013 | 2*X18*(305X457mm） | lectrodeposited Copper Foil 1 oz.(35μm) Unclad |
MAGTREX 555
材料的核心是由專有的低損耗、高電阻率陶瓷填料和高溫?zé)崴苄曰w制成，這種組合產(chǎn)生了一個在機械和電氣上都穩(wěn)定的系統(tǒng)。層壓板的X/Y軸磁導(dǎo)率和介電常數(shù)緊密匹配，分別為6和6.5，且在低于500
MHz的頻率下具有低磁損耗和介電損耗。此外，MAGTREX 555 層壓板具有低X、Y、Z
CTE(熱膨脹系數(shù))，與銅緊密匹配，確保了熱可靠性，厚度范圍從40至260密耳，并可提供帶或不帶銅包層。
這種層壓板特別適合于VHF和UHF天線的小型化設(shè)計，同時保持了與更大設(shè)計相當(dāng)?shù)膸?。MAGTREX 555 層壓板的制造工藝基于陶瓷/PTFE復(fù)合材料系統(tǒng)，類似于羅杰斯公司知名的RT/duroid層壓板。
MAGTREX 555 層壓板的特性包括匹配的磁導(dǎo)率和介電常數(shù)、高小型化系數(shù)、聚四氟乙烯復(fù)合層壓板、低吸濕性、低介電損耗和低磁損耗(低于500MHz)。這些特性帶來了多方面的好處，包括基板阻抗與空氣匹配、天線小型化和帶寬改進(jìn)、靈活且貼合的設(shè)計、環(huán)境穩(wěn)定的電氣性能以及高天線效率。
MAGTREX 555 Typical Value Property | Direction X=CMD Y=MD | Inits Condition Test Method | |||||
| Electric &Magnetic Properties | |||||||
| Dielectric Constant,(?) | 6.5 | X/Y | 400 MHz | Coaxial Airline 1"NRW Extraction | |||
| Dielectric Constant,(ε) | 5.3 | Z | 400 MHz | FSR,IPC-TM-650,2.5.5.6 | |||
| Permeability (μ) | 6.0 | X/Y | 400 MHz | Coaxial Airline 1"NRW Extraction | |||
| Dielectric Loss Tangen | 0.01 | X/Y | 400 MHz | Coaxial Airline 1"NRW Extraction | |||
| Magnetic Loss Tangen | <.05 | X/Y | 400 MHz | Coaxial Airline 1"NRW Extraction | |||
| Thermal Coefficent of Vs,μ | ~+1000 | ppy℃ | 250 MHz,0-100C | FSR,IPC-TM-650,2.5.5.6 | |||
| Thermal Coefficient of s | TBD | TBD | pp/℃ | TBD MHz | TBD | ||
| Thermal Coeffhidient of μ | TBD | TBD | pp/℃ | TBD MHz | TBD | ||
| Volume Resistivity | 615 | MO-CM | Condition A | IPC-TM-6502.5.17.1 | |||
| Surface Resistivity | 174 | MQ | Condition A | PC-TM-6502.5.17.1 | |||
| Electrical Strength | 131 | Z | V/mil | PC-TM-6502.5.6.2 | |||
| Dielectric Breakdown | 14.35 | kV | IPC-TM-6502.5.6 | ||||
| Curie Temperature | 241 | C | VSM | ||||
| f1(see Figures 1&2) | 499 | MHz | 23C | Coaxial Airline 1"NRW Extraction | |||
| f2 (see Figures 1&2) | 715 | MHz | 23C | Coaxial Airline 1"NRW Extraction | |||
| f3(see Figures 1&2) | 3900 | MHz | 23C | Coaxial Airline 1"NRW Extraction | |||
| ft(see Figures 1&2) | 2800 | MHz | 23C | Coaxial Airline 1"NRW Extraction | |||
| Mechanical Properties | |||||||
| Peel Strength | >3.1 | pli | 1oz ED After Solder Float | IPC-TM-6502.4.8 | |||
| Dimensional Stability | 0.15 0.18 | x Y | % | Condition A 0.50"sample thickness | IPC-TM-6502.2.4 | ||
| Flexural Strength | 10.6(1.54) 10.8(1.57) | x Y | MPa (ksi) | ASTM D790 | |||
| Flexural Modulus | 550(79.8) 572(82.9 | x Y | MPa (ksi) | ASTM D790 | |||
| Tensile Strength | 8.6(1.25) 6.7 (0.97) | x Y | MPa (ksi) | ASTM D638 | |||
| Tensile Modulus | 1482 (214.9 1502 (217.7) | x Y | MPa (ksi) | ASTM D638 | |||
| Compressive Strength | >143.8 (>20.8) | MPa(ksi | ASTM D3410/D3410M-16 | ||||
| Compressive Modulus | 2092 (303.4) | MPa (ksi | ASTM D3410/D3410M-16 | ||||
| Poisson's Ratio | 0.3685 | ASTM D3039/D3039M-14 | |||||
| Impact Strength | 9.77 (4.65) | kJ/m2 (ft lb/in2 | ASTM D256-10e1 | ||||
| Thermal Properties | |||||||
| Coefficient of Thermal Expansion | 22 | X | ppm/℃ | -55 to 288℃ | PCTM-6502.4.41 | ||
| 25 | Y | ||||||
| 25 | Z | ||||||
| 0.47 | W/mK | -55 to 288℃ | ASTM C518 | ||||
| Thermal Conductivity Decomposition Temperature (Td) | 500 | C | 5%weight loss | IPC-TM-6502.3.40 | |||
| T260 | >30 | min | TMA | IPC-TM-6502.4.24.1 | |||
| T288 | >30 | min | TMA | IPC-TM-6502.4.24.1 | |||
| Physical Properties | |||||||
| N/A | |||||||
| Flammability | <.25 | % | D48/50 | PCTM-6502.6.2.1 | |||
| Moisture Absorption | 3.45 | g/cm3 | C-24/23/50 | ASTM D792 Method A | |||
| Density | .765 | J/g/℃ | DSC | ASTM E1269-11 | |||
| Specific Lead Free | Heat Process | Compatible | PASS | ||||
| Outgassing | 0.02 | % | TML/CVCM | ASTM E595-15 | |||
 Fungus Resistance | PASS | IPC-TM-6502.6.1 | |||||
